Total physical thickness measurement of a multi-layered wafer using aspectral-domain interferometer with an optical comb

Collection with item attached
2017
Item details URL
http://open-repository.kisti.re.kr/cube/handle/open_repository/486353.do
DOI
10.1364/OE.25.012689
Title
Total physical thickness measurement of a multi-layered wafer using aspectral-domain interferometer with an optical comb
Description
Development of Application Technologies of Physical MeasurementStandards (17011023); Development of Next Generation ConvergingMeasurement Standards and Technology for Dimensional Metrology(17011024).
abstract
An interferometric method using an optical comb is proposed and realized to measure the total physical thickness of a multi-layered wafer even if the refractive index of each layer is not given. For a feasibility test, two-layered and three-layered silicon-on-glass wafers were chosen as samples and were measured. An uncertainty evaluation was conducted to estimate the performance capabilities of the proposed method. To verify the measured values, the wafers were also measured by a contact-type standard instrument. For the three-layered wafer, the total physical thickness distribution was determined in a selected area. (C) 2017 Optical Society of America
provenance
Made available in Cube on 2018-09-28T16:05:20Z (GMT). No. of bitstreams: 0
language
English
author
Bae, Jaeseok
Park, Jungjae
Ahn, Heulbi
Jin, Jonghan
orcid
Jin, Jonghan/0000-0002-3511-4636
accessioned
2018-09-28T16:05:20Z
available
2018-09-28T16:05:20Z
issued
2017
citation
OPTICS EXPRESS(25): 11
issn
1094-4087
uri
http://open-repository.kisti.re.kr/cube/handle/open_repository/486353.do
Funder
과학기술정보통신부
Funding Program
한국표준과학연구원연구운영비지원
Project ID
1711062919
Jurisdiction
Rep.of Korea
Project Name
대기환경 측정표준 기술 개발
rights
openAccess
type
article


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