Adhesive Defect Monitoring of Glass Fiber Epoxy Plate Using anImpedance-Based Non-Destructive Testing Method for Multiple Structures

Collection with item attached
2017
Item details URL
http://open-repository.kisti.re.kr/cube/handle/open_repository/474322.do
DOI
10.3390/s17061439
Title
Adhesive Defect Monitoring of Glass Fiber Epoxy Plate Using anImpedance-Based Non-Destructive Testing Method for Multiple Structures
Description
The research was supported by a grant from "Development ofinfrastructure technology for hyper speed transportation system(20170095-001)" funded by Korea Institute of Civil engineering andbuilding Technology (KICT), Korea.
abstract
The emergence of composite materials has revolutionized the approach to building engineering structures. With the number of applications for composites increasing every day, maintaining structural integrity is of utmost importance. For composites, adhesive bonding is usually the preferred choice over the mechanical fastening method, and monitoring for delamination is an essential factor in the field of composite materials. In this study, a non-destructive method known as the electromechanical impedance method is used with an approach of monitoring multiple areas by specifying certain frequency ranges to correspond to a certain test specimen. Experiments are conducted using various numbers of stacks created by attaching glass fiber epoxy composite plates onto one another, and two different debonding damage types are introduced to evaluate the performance of the multiple monitoring electromechanical impedance method.
provenance
Made available in Cube on 2018-09-28T10:42:58Z (GMT). No. of bitstreams: 0
language
English
author
Na, Wongi S.
Baek, Jongdae
accessioned
2018-09-28T10:42:58Z
available
2018-09-28T10:42:58Z
issued
2017
citation
SENSORS(17): 6
issn
1424-8220
uri
http://open-repository.kisti.re.kr/cube/handle/open_repository/474322.do
Funder
과학기술정보통신부
Funding Program
한국건설기술연구원연구운영비지원
Project ID
1711062388
Jurisdiction
Rep.of Korea
Project Name
차세대 초고속 이동체계(Hyperloop) 기반 기술 개발
rights
openAccess
subject
adhesive bonding
glass fiber composite
non-destructive testing
electromechanical impedance
piezoelectric transducer
type
article


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